Single-Phase Direct Liquid Cooling for AI and High-Performance Computing

Single-phase direct liquid cooling is emerging as a solution to manage the increasing thermal demands of AI and high-performance computing, where processors exceed 1,000 watts and racks dissipate over 100 kilowatts. This cooling method circulates a coolant through coldplates on high-heat components, effectively removing heat more efficiently than air cooling. The paper compares this approach with two-phase and immersion cooling methods, highlighting its advantages in supporting higher chip and rack densities.